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XCZU55DR-1FSVE1156I

Manufacturer:

Xilinx

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Package Case:

1156-BBGA, FCBGA

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XCZU55DR-1FSVE1156I information

Specifications

XCZU55DR-1FSVE1156I technical specifications, attributes, parameters and parts with similar specifications to XCZU55DR-1FSVE1156I .

manufacturer
Xilinx
Package / Case
1156-BBGA, FCBGA
Supplier Device Package
1156-FCBGA (35x35)
Brand
Xilinx
Factory Pack QuantityFactory Pack Quantity
1
Manufacturer
Xilinx
Mfr
AMD Xilinx
Package
Tray
Product Status
Active
Operating Temperature
-40°C ~ 100°C (TJ)
Series
Zynq® UltraScale+™ RFSoC DR
Temperature Coefficient
100 ppm/K
Resistance
680 Ohm
Subcategory
SOC - Systems on a Chip
Power Rating
0.05 W
Resistor Type
General Purpose
Speed
500MHz, 1.2GHz
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DDR, DMA, PCIe, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MPU, FPGA
Resistance Tolerance
1
Primary Attributes
Zynq® UltraScale+™ RFSoC
Product Category
SoC FPGA
Product Length
0.6 mm
Product Width
0.3 mm