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M2S060T-1FCSG325

Manufacturer:

Microchip Technology

Factory Lead Time

Package Case:

325-TFBGA, FCBGA

Datasheet:

Rohs:

Inventory:

2485

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M2S060T-1FCSG325 information

Specifications

M2S060T-1FCSG325 technical specifications, attributes, parameters and parts with similar specifications to M2S060T-1FCSG325 .

manufacturer
Microchip Technology
Lifecycle Status
Production (Last Updated: 2 months ago)
Package / Case
325-TFBGA, FCBGA
Surface Mount
YES
Supplier Device Package
325-FCBGA (11x11)
Number of Terminals
325
Base Product Number
M2S060
Data RAM Size
64 kB
Factory Pack QuantityFactory Pack Quantity
176
Ihs Manufacturer
MICROSEMI CORP
Manufacturer Part Number
M2S060T-1FCSG325
Maximum Clock Frequency
166 MHz
Mfr
Microchip Technology
Moisture Sensitive
Yes
Moisture Sensitivity Levels
3
Number of I/Os
200
Number of Logic Array Blocks - LABs
4710 LAB
Number of Logic Elements
56520 LE
Operating Temperature-Max
85 °C
Package
Tray
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Description
FBGA-325
Package Equivalence Code
BGA325,21X21,20
Package Shape
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Part Life Cycle Code
Active
Product Status
Active
Reflow Temperature-Max (s)
40
Risk Rank
5.82
Rohs Code
Yes
Shipping Restrictions
This product may require additional documentation to export from the United States.
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Tradename
SmartFusion2
Operating Temperature
0°C ~ 85°C (TJ)
Packaging
Tray
Series
SmartFusion2
JESD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
LG-MIN, WD-MIN
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Terminal Pitch
0.5 mm
Reach Compliance Code
compliant
JESD-30 Code
S-PBGA-B325
Number of Outputs
200
Qualification Status
Not Qualified
Power Supplies
1.2 V
Temperature Grade
OTHER
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR, PCIe, SERDES
Program Memory Size
256 kB
Connectivity
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Number of Inputs
200
Seated Height-Max
1.01 mm
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes
FPGA - 60K Logic Modules
Number of Logic Cells
56520
Number of Cores
1 Core
Flash Size
256KB
Length
11 mm
Width
11 mm