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XCZU3EG-2SFVC784I

XCZU3EG-2SFVC784I

Manufacturer:

Xilinx Inc.

Factory Lead Time

Package Case:

784-BFBGA, FCBGA

Datasheet:

-

Rohs:

ROHS3 Compliant

Inventory:

2000

Quantity:

Delivery:

Payment:

In Stock : Please Inquire

Please send RFQ , we will respond immediately.

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XCZU3EG-2SFVC784I information

Specifications
XCZU3EG-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to XCZU3EG-2SFVC784I .
  • manufacturer
  • Xilinx Inc.
  • Factory Lead Time
  • 11 Weeks
  • Package / Case
  • 784-BFBGA, FCBGA
  • Surface Mount
  • YES
  • Number of I/Os
  • 252
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Published
  • 2016
  • Series
  • Zynq® UltraScale+™ MPSoC EG
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 784
  • HTS Code
  • 8542.31.00.01
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Supply Voltage
  • 0.85V
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • JESD-30 Code
  • R-PBGA-B784
  • Supply Voltage-Max (Vsup)
  • 0.876V
  • Supply Voltage-Min (Vsup)
  • 0.825V
  • Speed
  • 533MHz, 600MHz, 1.3GHz
  • RAM Size
  • 256KB
  • uPs/uCs/Peripheral ICs Type
  • MICROPROCESSOR CIRCUIT
  • Core Processor
  • Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
  • DMA, WDT
  • Connectivity
  • CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
  • MCU, FPGA
  • Primary Attributes
  • Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
  • RoHS Status
  • ROHS3 Compliant
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