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M2S005S-1FGG484T2

Manufacturer:

Microchip Technology

Factory Lead Time

Package Case:

BGA-484

Datasheet:

Rohs:

Inventory:

5000

Quantity:

Delivery:

Payment:

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M2S005S-1FGG484T2 information

Specifications

M2S005S-1FGG484T2 technical specifications, attributes, parameters and parts with similar specifications to M2S005S-1FGG484T2 .

manufacturer
Microchip Technology
Package / Case
BGA-484
Supplier Device Package
484-FPBGA (23x23)
Base Product Number
M2S005
Data RAM Size
64 kB
Distributed RAM
191 kbit
Factory Pack QuantityFactory Pack Quantity
60
Ihs Manufacturer
MICROSEMI CORP
Manufacturer Part Number
M2S005S-1FGG484T2
Maximum Clock Frequency
166 MHz
Maximum Operating Temperature
+ 85 C
Mfr
Microchip Technology
Minimum Operating Temperature
0 C
Moisture Sensitive
Yes
Mounting Styles
SMD/SMT
Number of I/Os
209 I/O
Number of Logic Array Blocks - LABs
505 LAB
Number of Logic Elements
6060 LE
Package
Tray
Package Description
,
Part Life Cycle Code
Active
Product Status
Active
Reflow Temperature-Max (s)
40
Risk Rank
5.81
Rohs Code
Yes
Shipping Restrictions
This product may require additional documentation to export from the United States.
Typical Operating Supply Voltage
1.2000 V
Operating Temperature
0 to 85 °C
Packaging
Tray
Series
SmartFusion2
JESD-609 Code
e1
Pbfree Code
Yes
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel)
250
Reach Compliance Code
compliant
Operating Supply Voltage
1.2 V
Speed
166MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DDR
Program Memory Size
128 kB
Connectivity
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Speed Grade
1
Primary Attributes
FPGA - 5K Logic Modules
Number of Cores
1 Core
Flash Size
128KB