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M2S025TS-1FGG484

M2S025TS-1FGG484

Manufacturer:

Microchip Technology

Factory Lead Time

Package Case:

FPBGA-484

Datasheet:

-

Rohs:

-

Inventory:

2452

Quantity:

Delivery:

Payment:

In Stock : Please Inquire

Please send RFQ , we will respond immediately.

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Shipping Cost

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FedEx International, 5-7 business days.

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M2S025TS-1FGG484 information

Specifications
M2S025TS-1FGG484 technical specifications, attributes, parameters and parts with similar specifications to M2S025TS-1FGG484 .
  • manufacturer
  • Microchip Technology
  • Lifecycle Status
  • Production (Last Updated: 2 months ago)
  • Package / Case
  • FPBGA-484
  • Surface Mount
  • YES
  • Supplier Device Package
  • 484-FPBGA (23x23)
  • Number of Terminals
  • 484
  • Base Product Number
  • M2S025
  • Data RAM Size
  • 64 kB
  • Factory Pack QuantityFactory Pack Quantity
  • 60
  • Ihs Manufacturer
  • MICROSEMI CORP
  • Manufacturer Part Number
  • M2S025TS-1FGG484
  • Maximum Clock Frequency
  • 166 MHz
  • Mfr
  • Microchip Technology
  • Moisture Sensitive
  • Yes
  • Moisture Sensitivity Levels
  • 3
  • Mounting Styles
  • SMD/SMT
  • Number of I/Os
  • 267
  • Number of Logic Array Blocks - LABs
  • 2308 LAB
  • Number of Logic Elements
  • 27696 LE
  • Operating Temperature-Max
  • 85 °C
  • Package
  • Tray
  • Package Body Material
  • PLASTIC/EPOXY
  • Package Code
  • BGA
  • Package Description
  • FBGA-484
  • Package Equivalence Code
  • BGA484,22X22,40
  • Package Shape
  • SQUARE
  • Package Style
  • GRID ARRAY
  • Part Life Cycle Code
  • Active
  • Product Status
  • Active
  • Reflow Temperature-Max (s)
  • 40
  • Risk Rank
  • 5.8
  • Rohs Code
  • Yes
  • Shipping Restrictions
  • This product may require additional documentation to export from the United States.
  • Supply Voltage-Max
  • 1.26 V
  • Supply Voltage-Min
  • 1.14 V
  • Supply Voltage-Nom
  • 1.2 V
  • Operating Temperature
  • 0°C ~ 85°C (TJ)
  • Packaging
  • Tray
  • Series
  • SmartFusion2
  • JESD-609 Code
  • e1
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
  • 8542.39.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 250
  • Terminal Pitch
  • 1 mm
  • Reach Compliance Code
  • compliant
  • JESD-30 Code
  • S-PBGA-B484
  • Number of Outputs
  • 267
  • Qualification Status
  • Not Qualified
  • Power Supplies
  • 1.2 V
  • Temperature Grade
  • OTHER
  • Speed
  • 166MHz
  • RAM Size
  • 64KB
  • Core Processor
  • ARM® Cortex®-M3
  • Peripherals
  • DDR, PCIe, SERDES
  • Program Memory Size
  • 256 kB
  • Connectivity
  • CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Architecture
  • MCU, FPGA
  • Number of Inputs
  • 267
  • Seated Height-Max
  • 2.44 mm
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
  • FPGA - 25K Logic Modules
  • Number of Logic Cells
  • 27696
  • Number of Cores
  • 1 Core
  • Flash Size
  • 256KB
  • Length
  • 23 mm
  • Width
  • 23 mm
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