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10AS022E3F29E2SG

Manufacturer:

ALTERA

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Package Case:

FBGA-780

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10AS022E3F29E2SG information

Specifications

10AS022E3F29E2SG technical specifications, attributes, parameters and parts with similar specifications to 10AS022E3F29E2SG .

manufacturer
ALTERA
Mounting Type
Free Hanging (In-Line)
Package / Case
FBGA-780
Surface Mount
YES
Shell Material
Composite
Insert Material
Thermoplastic
Number of Terminals
780
Base Product Number
D38999/26JH
Brand
Intel / Altera
Contact Finish Mating
Gold
Contact Materials
Copper Alloy
Factory Pack QuantityFactory Pack Quantity
1
Ihs Manufacturer
INTEL CORP
L1 Cache Data Memory
2 x 32 kB
L1 Cache Instruction Memory
2 x 32 kB
Manufacturer
Intel
Manufacturer Part Number
10AS022E3F29E2SG
Maximum Clock Frequency
1.2 GHz
Mfr
TE Connectivity Deutsch Connectors
Moisture Sensitive
Yes
Mounting Styles
SMD/SMT
Number of I/Os
288
Number of Logic Array Blocks - LABs
27500 LAB
Number of Logic Elements
220000 LE
Operating Temperature-Max
100 °C
Package
Bulk
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Description
BGA, BGA780,28X28,40
Package Equivalence Code
BGA780,28X28,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Part # Aliases
973473
Part Life Cycle Code
Active
Primary Material
Composite
Product Status
Discontinued at Digi-Key
Reflow Temperature-Max (s)
NOT SPECIFIED
Risk Rank
5.46
Rohs Code
Yes
Shipping Restrictions
This product may require additional documentation to export from the United States.
Supply Voltage-Max
0.93 V
Supply Voltage-Min
0.87 V
Supply Voltage-Nom
0.9 V
Tradename
Arria 10 SoC
Operating Temperature
-65°C ~ 175°C
Packaging
Tray
Series
Military, MIL-DTL-38999 Series III, ACT
Part Status
Active
Termination
Crimp
Connector Type
Plug, Female Sockets
Number of Positions
55
Color
Olive Drab
Applications
Aerospace, Military
HTS Code
8542.39.00.01
Fastening Type
Threaded
Subcategory
SOC - Systems on a Chip
Current Rating (Amps)
7.5A
Technology
CMOS
Terminal Position
BOTTOM
Orientation
B
Terminal Form
BALL
Shielding
Shielded
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Ingress Protection
Environment Resistant
Terminal Pitch
1 mm
Reach Compliance Code
compliant
Shell Finish
Olive Drab Cadmium
Shell Size - Insert
23-55
JESD-30 Code
S-PBGA-B780
Number of Outputs
288
Qualification Status
Not Qualified
Power Supplies
0.9 V
Temperature Grade
OTHER
Speed
1.5GHz
RAM Size
256KB
Shell Size, MIL
H
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Number of Inputs
288
Seated Height-Max
3.35 mm
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Product Type
SoC FPGA
Primary Attributes
FPGA - 220K Logic Elements
Number of Logic Cells
220000
Number of Cores
2 Core
Flash Size
--
Product Category
SoC FPGA
Length
29 mm
Width
29 mm
Contact Finish Thickness - Mating
50.0µin (1.27µm)