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MPFS250TL-FCVG784I

Manufacturer:

Microchip Technology

Factory Lead Time

Package Case:

BGA-784

Datasheet:

Rohs:

Inventory:

661

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MPFS250TL-FCVG784I information

Specifications

MPFS250TL-FCVG784I technical specifications, attributes, parameters and parts with similar specifications to MPFS250TL-FCVG784I .

manufacturer
Microchip Technology
Package / Case
BGA-784
Supplier Device Package
784-FCBGA (23x23)
Factory Pack QuantityFactory Pack Quantity
1
L1 Cache Data Memory
4 x 32 kB
L1 Cache Instruction Memory
16 kB, 4 x 32 kB
Maximum Clock Frequency
667 MHz, 667 MHz
Maximum Operating Temperature
+ 100 C
Mfr
Microchip Technology
Minimum Operating Temperature
- 40 C
Mounting Styles
SMD/SMT
Number of I/Os
372 I/O
Number of Logic Elements
254000 LE
Package
Tray
Product Status
Active
Shipping Restrictions
This product may require additional documentation to export from the United States.
Operating Temperature
-40°C ~ 100°C
Packaging
Tray
Series
PolarFire™
Operating Supply Voltage
1 V
RAM Size
2.2MB
Core Processor
RISC-V
Peripherals
DMA, PCI, PWM
Connectivity
CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Architecture
MPU, FPGA
Primary Attributes
FPGA - 254K Logic Modules
Number of Cores
5 Core
Flash Size
128kB