Categories
SoC
|
Product |
Inventory |
Pricing(USD) |
Quantity |
Factory Lead Time |
Mount |
Package / Case |
Number of Pins |
Packaging |
Published |
Series |
Part Status |
Moisture Sensitivity Level (MSL) |
Color |
Gender |
Voltage - Rated DC |
Number of Conductors |
Operating Supply Voltage |
Interface |
Number of Bits |
Accessory Type |
Data Bus Width |
Evaluation Kit |
Core Architecture |
Length |
Radiation Hardening |
REACH SVHC |
RoHS Status |
Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
A2F200M3F-1CS288
Microchip Technology |
33 |
0.00 |
|
- |
- |
288-TFBGA, CSPBGA |
- |
Tray |
- |
A2F200 |
- |
- |
- |
- |
- |
11 mm |
- |
- |
||||||||||
|
XC7Z007S-2CLG225I
Xilinx Inc. |
1600 |
0.00 |
|
10 Weeks |
- |
225-LFBGA, CSPBGA |
- |
Tray |
2016 |
Zynq®-7000 |
Active |
- |
- |
- |
- |
13mm |
- |
ROHS3 Compliant |
||||||||||
|
XCZU11EG-2FFVC1760I
Xilinx Inc. |
600 |
0.00 |
|
11 Weeks |
- |
1760-BBGA, FCBGA |
- |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EG |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||
|
5CSXFC4C6U23I7N
Intel |
2654 |
0.00 |
|
8 Weeks |
- |
672-FBGA |
- |
Tray |
2018 |
Cyclone® V SX |
Active |
- |
- |
- |
- |
23mm |
- |
RoHS Compliant |
||||||||||
|
XC7Z030-1FBG484C
Xilinx Inc. |
677 |
0.00 |
|
10 Weeks |
- |
484-BBGA, FCBGA |
484 |
Tray |
2009 |
Zynq®-7000 |
Active |
1V |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
32b |
ARM |
23mm |
No |
ROHS3 Compliant |
||||||||||
|
5CSEBA5U23I7N
Intel |
2117 |
0.00 |
|
8 Weeks |
- |
672-FBGA |
- |
Tray |
2018 |
Cyclone® V SE |
Active |
- |
- |
- |
- |
23mm |
- |
RoHS Compliant |
||||||||||
|
XCZU9EG-2FFVB1156E
Xilinx Inc. |
678 |
0.00 |
|
11 Weeks |
- |
1156-BBGA, FCBGA |
- |
Tray |
2013 |
Zynq® UltraScale+™ MPSoC EG |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||
|
XC7Z035-3FFG900E
Xilinx Inc. |
810 |
0.00 |
|
10 Weeks |
Surface Mount |
900-BBGA, FCBGA |
- |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
- |
- |
ROHS3 Compliant |
||||||||||
|
M2S025TS-1FGG484
Microchip Technology |
2452 |
0.00 |
|
- |
- |
FPBGA-484 |
- |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
23 mm |
- |
- |
||||||||||
|
XC7Z010-L1CLG400I
Xilinx Inc. |
900 |
0.00 |
|
10 Weeks |
Surface Mount |
400-LFBGA, CSPBGA |
- |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
17mm |
- |
ROHS3 Compliant |
||||||||||
|
XA7Z020-1CLG400Q
Xilinx Inc. |
10800 |
0.00 |
|
10 Weeks |
Surface Mount |
400-LFBGA, CSPBGA |
400 |
Tray |
2010 |
Automotive, AEC-Q100, Zynq®-7000 XA |
Active |
1V |
CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
32b |
ARM |
17mm |
- |
ROHS3 Compliant |
||||||||||
|
XCZU6CG-1FFVB1156I
Xilinx Inc. |
612 |
0.00 |
|
11 Weeks |
- |
1156-BBGA, FCBGA |
- |
Bulk |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||
|
5CSXFC5D6F31I7N
Intel |
142 |
0.00 |
|
8 Weeks |
- |
896-BGA |
- |
Tray |
2018 |
Cyclone® V SX |
Active |
- |
- |
- |
- |
31mm |
- |
RoHS Compliant |
||||||||||
|
XCZU4EV-1SFVC784E
Xilinx Inc. |
3000 |
0.00 |
|
11 Weeks |
- |
784-BFBGA, FCBGA |
- |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EV |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||
|
M2S025T-FGG484
Atmel (Microchip Technology) |
In Stock |
0.00 |
|
- |
- |
FPBGA-484 |
- |
Tray |
- |
SmartFusion2 |
- |
1.2 V |
- |
- |
- |
- |
- |
- |
