Categories
SoC
|
Product |
Inventory |
Pricing(USD) |
Quantity |
Factory Lead Time |
Mount |
Package / Case |
Number of Pins |
Packaging |
Published |
Series |
Part Status |
Moisture Sensitivity Level (MSL) |
Color |
Gender |
Voltage - Rated DC |
Number of Conductors |
Operating Supply Voltage |
Interface |
Number of Bits |
Accessory Type |
Data Bus Width |
Evaluation Kit |
Core Architecture |
Length |
Radiation Hardening |
REACH SVHC |
RoHS Status |
Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
A2F500M3G-1FG256
Microchip Technology |
2822 |
0.00 |
|
- |
- |
FPBGA-256 |
Tray |
- |
A2F500 |
- |
- |
- |
- |
- |
17 mm |
- |
- |
|||||||||||
M2S005S-TQG144I
Atmel (Microchip Technology) |
In Stock |
0.00 |
|
- |
- |
TQFP-144 |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
- |
- |
- |
|||||||||||
XCZU9EG-2FFVC900I
Xilinx Inc. |
392 |
0.00 |
|
11 Weeks |
- |
900-BBGA, FCBGA |
Tray |
- |
Zynq® UltraScale+™ MPSoC EG |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
XCZU4CG-1SFVC784I
Xilinx Inc. |
559 |
0.00 |
|
11 Weeks |
- |
784-BFBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
M2S050-FGG484
Atmel (Microchip Technology) |
In Stock |
0.00 |
|
- |
- |
BGA-484 |
Tray |
- |
SmartFusion2 |
- |
1.2 V |
- |
- |
- |
- |
- |
- |
|||||||||||
XC7Z035-1FFG676C
Xilinx Inc. |
711 |
0.00 |
|
10 Weeks |
- |
676-BBGA, FCBGA |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
27mm |
- |
ROHS3 Compliant |
|||||||||||
XC7Z015-L1CLG485I
Xilinx Inc. |
77 |
0.00 |
|
10 Weeks |
Surface Mount |
484-LFBGA, CSPBGA |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
19mm |
- |
ROHS3 Compliant |
|||||||||||
XCZU4EV-2SFVC784I
Xilinx Inc. |
1600 |
0.00 |
|
11 Weeks |
- |
784-BFBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EV |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
XC7Z045-3FBG676E
Xilinx Inc. |
530 |
0.00 |
|
10 Weeks |
- |
676-BBGA, FCBGA |
Tray |
2009 |
Zynq®-7000 |
Active |
1V |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
32b |
ARM |
27mm |
No |
ROHS3 Compliant |
|||||||||||
M2S090-1FGG484
Microchip Technology |
In Stock |
0.00 |
|
- |
- |
FPBGA-484 |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
- |
- |
- |
|||||||||||
5CSEBA2U23A7N
Intel |
2170 |
0.00 |
|
8 Weeks |
- |
672-FBGA |
Tray |
- |
Automotive, AEC-Q100, Cyclone® V SE |
Active |
- |
- |
- |
- |
23mm |
- |
RoHS Compliant |
|||||||||||
5CSXFC6C6U23C7N
Intel |
In Stock |
0.00 |
|
8 Weeks |
- |
672-FBGA |
Tray |
2018 |
Cyclone® V SX |
Active |
- |
- |
- |
- |
23mm |
- |
RoHS Compliant |
|||||||||||
XCZU4EV-2SFVC784E
Xilinx Inc. |
900 |
0.00 |
|
11 Weeks |
- |
784-BFBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EV |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
XCZU15EG-2FFVB1156I
Xilinx Inc. |
100 |
0.00 |
|
11 Weeks |
- |
1156-BBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EG |
Active |
- |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
5CSEBA2U19I7SN
Intel |
6 |
0.00 |
|
8 Weeks |
- |
484-FBGA |
Tray |
2018 |
Cyclone® V SE |
Active |
- |
- |
- |
- |
19mm |
- |
RoHS Compliant |
