Categories
SoC
|
Product |
Inventory |
Pricing(USD) |
Quantity |
Factory Lead Time |
Mount |
Package / Case |
Number of Pins |
Packaging |
Published |
Series |
Part Status |
Moisture Sensitivity Level (MSL) |
Color |
Gender |
Voltage - Rated DC |
Number of Conductors |
Operating Supply Voltage |
Interface |
Number of Bits |
Accessory Type |
Data Bus Width |
Evaluation Kit |
Core Architecture |
Length |
Radiation Hardening |
REACH SVHC |
RoHS Status |
Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
A2F500M3G-1CS288
Microchip Technology |
11 |
0.00 |
|
- |
288-TFBGA, CSPBGA |
Tray |
- |
A2F500 |
- |
11 mm |
- |
|||||||||||||||||
|
M2S060T-1FCSG325
Microchip Technology |
2485 |
0.00 |
|
- |
325-TFBGA, FCBGA |
Tray |
- |
SmartFusion2 |
- |
11 mm |
- |
|||||||||||||||||
|
XCZU2CG-1SBVA484I
Xilinx Inc. |
504 |
0.00 |
|
11 Weeks |
- |
484-BFBGA, FCBGA |
- |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
|
5CSXFC5C6U23I7N
Intel |
751 |
0.00 |
|
8 Weeks |
- |
672-FBGA |
- |
Tray |
2018 |
Cyclone® V SX |
Active |
- |
- |
- |
- |
23mm |
RoHS Compliant |
|||||||||||
|
XCZU17EG-2FFVC1760E
Xilinx Inc. |
60 |
0.00 |
|
11 Weeks |
- |
1760-BBGA, FCBGA |
- |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EG |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
|
XC7Z012S-2CLG485I
Xilinx Inc. |
2347 |
0.00 |
|
10 Weeks |
- |
484-LFBGA, CSPBGA |
- |
Tray |
2016 |
Zynq®-7000 |
Active |
- |
- |
- |
- |
19mm |
ROHS3 Compliant |
|||||||||||
|
5CSEMA4U23I7N
Intel |
2358 |
0.00 |
|
8 Weeks |
- |
672-FBGA |
- |
Tray |
2018 |
Cyclone® V SE |
Active |
- |
- |
- |
- |
23mm |
RoHS Compliant |
|||||||||||
|
XC7Z045-L2FFG676I
Xilinx Inc. |
926 |
0.00 |
|
10 Weeks |
Surface Mount |
676-BBGA, FCBGA |
- |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
27mm |
ROHS3 Compliant |
|||||||||||
|
M2S010TS-1VF256I
Microchip Technology |
26 |
0.00 |
|
- |
- |
VFPBGA-256 |
- |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
14 mm |
- |
|||||||||||
|
M2S005S-1VFG400T2
Microchip Technology |
17 |
0.00 |
|
- |
- |
BGA-400 |
- |
Tray |
- |
SmartFusion2 |
- |
1.2 V |
- |
- |
- |
- |
- |
|||||||||||
|
A2F500M3G-CS288
Microchip Technology |
33 |
0.00 |
|
- |
- |
288-TFBGA, CSPBGA |
- |
Tray |
- |
A2F500 |
- |
- |
- |
- |
- |
- |
- |
|||||||||||
|
M2S050-1VFG400I
Microchip Technology |
2477 |
0.00 |
|
- |
- |
VFPBGA-400 |
- |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
17 mm |
- |
|||||||||||
|
XC7Z020-L1CLG484I
Xilinx Inc. |
2878 |
0.00 |
|
10 Weeks |
Surface Mount |
484-LFBGA, CSPBGA |
- |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
19mm |
ROHS3 Compliant |
|||||||||||
|
XCZU4CG-1FBVB900E
Xilinx Inc. |
3000 |
0.00 |
|
11 Weeks |
- |
900-BBGA, FCBGA |
- |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
|||||||||||
|
5CSTFD6D5F31I7N
Intel |
2822 |
0.00 |
|
8 Weeks |
- |
896-BGA |
- |
Tray |
2018 |
Cyclone® V ST |
Active |
- |
- |
- |
- |
31mm |
RoHS Compliant |
