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MCIMX6S5DVM10AC

Manufacturer:

NXP USA Inc.

Factory Lead Time

Package Case:

624-LFBGA

Datasheet:

Rohs:

ROHS3 Compliant

Inventory:

680

Quantity:

Delivery:

Payment:

In Stock : Please Inquire

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MCIMX6S5DVM10AC information

Specifications

MCIMX6S5DVM10AC technical specifications, attributes, parameters and parts with similar specifications to MCIMX6S5DVM10AC .

manufacturer
NXP USA Inc.
Factory Lead Time
15 Weeks
Package / Case
624-LFBGA
Surface Mount
YES
Operating Temperature
0°C~95°C TJ
Packaging
Tray
Published
2002
Series
i.MX6S
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
624
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B624
Supply Voltage-Max (Vsup)
1.5V
Supply Voltage-Min (Vsup)
1.35V
Speed
1.0GHz
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Core Processor
ARM® Cortex®-A9
Address Bus Width
26
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Voltage - I/O
1.8V 2.5V 2.8V 3.3V
Ethernet
10/100/1000Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
Yes
RAM Controllers
LPDDR2, LVDDR3, DDR3
USB
USB 2.0 + PHY (4)
Additional Interfaces
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP
Multimedia; NEON™ SIMD
Security Features
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers
Keypad, LCD
Height Seated (Max)
1.6mm
Length
21mm
RoHS Status
ROHS3 Compliant