Categories
SoC
|
Product |
Inventory |
Pricing(USD) |
Quantity |
Factory Lead Time |
Mount |
Package / Case |
Number of Pins |
Packaging |
Published |
Series |
Part Status |
Moisture Sensitivity Level (MSL) |
Color |
Gender |
Voltage - Rated DC |
Number of Conductors |
Operating Supply Voltage |
Interface |
Number of Bits |
Accessory Type |
Data Bus Width |
Evaluation Kit |
Core Architecture |
Length |
Radiation Hardening |
REACH SVHC |
RoHS Status |
Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
M2S150TS-1FCV484I
Microchip Technology |
878 |
0.00 |
|
- |
- |
484-BFBGA |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
19 mm |
- |
||||||||||||
|
XCZU2CG-1SBVA484E
Xilinx Inc. |
5000 |
0.00 |
|
11 Weeks |
- |
484-BFBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||||
|
XCZU9EG-2FFVC900E
Xilinx Inc. |
3000 |
0.00 |
|
11 Weeks |
- |
900-BBGA, FCBGA |
Tray |
2013 |
Zynq® UltraScale+™ MPSoC EG |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||||
|
XCZU4CG-L1SFVC784I
Xilinx Inc. |
265 |
0.00 |
|
11 Weeks |
- |
784-BFBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||||
|
XCZU7EV-1FFVC1156I
Xilinx Inc. |
169 |
0.00 |
|
11 Weeks |
- |
1156-BBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC EV |
Active |
- |
- |
- |
- |
- |
ROHS3 Compliant |
||||||||||||
|
XC7Z030-L2FBG484I
Xilinx Inc. |
2543 |
0.00 |
|
10 Weeks |
- |
484-BBGA, FCBGA |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
23mm |
ROHS3 Compliant |
||||||||||||
|
5CSEBA2U23C8SN
Intel |
6 |
0.00 |
|
8 Weeks |
- |
672-FBGA |
Tray |
2018 |
Cyclone® V SE |
Active |
- |
- |
- |
- |
23mm |
RoHS Compliant |
||||||||||||
|
M2S050TS-1FCS325
Microchip Technology |
2792 |
0.00 |
|
- |
- |
FCBGA-325 |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
- |
- |
||||||||||||
|
M2S025TS-FCS325
Microchip Technology |
2619 |
0.00 |
|
- |
- |
325-TFBGA, FCBGA |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
- |
- |
||||||||||||
|
M2S025TS-VFG400I
Microchip Technology |
2221 |
0.00 |
|
- |
- |
VFPBGA-400 |
Tray |
- |
SmartFusion2 |
- |
- |
- |
- |
- |
17 mm |
- |
||||||||||||
|
XC7Z030-L2SBG485I
Xilinx Inc. |
2836 |
0.00 |
|
10 Weeks |
Surface Mount |
484-FBGA, FCBGA |
Tray |
2010 |
Zynq®-7000 |
Active |
- |
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
- |
ARM |
19mm |
ROHS3 Compliant |
||||||||||||
|
XCZU27DR-2FFVG1517I5180
Xilinx |
In Stock |
0.00 |
|
- |
- |
FBGA-1517 |
- |
- |
- |
- |
850 mV |
- |
- |
- |
- |
- |
||||||||||||
|
5CSEBA2U19C7N
Intel |
3000 |
0.00 |
|
8 Weeks |
484-FBGA |
Tray |
2018 |
Cyclone® V SE |
Active |
19mm |
RoHS Compliant |
|||||||||||||||||
|
XCZU6CG-1FFVC900E
Xilinx Inc. |
233 |
0.00 |
|
11 Weeks |
900-BBGA, FCBGA |
Tray |
2016 |
Zynq® UltraScale+™ MPSoC CG |
Active |
- |
ROHS3 Compliant |
|||||||||||||||||
|
5CSEBA4U23I7N
Intel |
360 |
0.00 |
|
8 Weeks |
672-FBGA |
Tray |
2018 |
Cyclone® V SE |
Active |
23mm |
RoHS Compliant |
